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  1. Datacon Technology GmbH - RFID, Flip Chip, Multi Chip, SIP, MCM, CMOS

    high-precision assembly equipment for the advanced packaging market; specialist in the field of RFID, Flip Chip, System in Package (SIP), MCM, CMOS, Die Bonding
    sip2
    rfid tag1
    flip chip1
    die bonder1
    system in package1
    datacon1
    multi chip1
    thin die handling0

    www.datacon.at - 2009-02-08

  2. Staccato Communications

    Staccato Communications provides the leading Ultra Wideband (UWB) solutions based on Single Chip CMOS.
    SiP2
    CSP1
    CMOS1
    UWB1
    LTCC1
    Staccato1
    Wireless USB1
    WiMedia1
    Ultrawideband1
    WUSB1
    Ultra Wideband1
    Ultra wide band1
    System in package1
    Single-Chip1
    WiNET1
    MBOA1
    WCSP1
    Bluetooth 3.01
    Certified Wireless USB1
    All-CMOS1
    Bluetooth31
    Bluetooth3.01
    Bluetooth over UWB1
    CWUSB1
    Multi Band OFDM1
    PASN1
    Staccato Communications1
    Team Staccato1
    W13941
    WiMedia Alliance1
    Wireless 13941

    staccatocommunications.com - 2009-02-08

  3. Wadsworth-Pacific Home Page

    Wadsworth-Pacific is a pioneer representative firm specializing in leading-edge materials for semiconductor fab, assembly and packaging. LTCC, stamped and ...
    tubes2
    BGA1
    backend1
    thinning1
    PDI1
    back end1
    diamond wheels1
    Furukawa1
    LTCC1
    tape and reel1
    lead frame1
    leadframes1
    semiconductor assembly1
    wafer thinning1
    System in Package1
    vinyl packaging1
    AlTiC1
    backgrinding1
    final manufacturing1
    heatspreaders1
    Plastic Development1
    Atlantic Diamond0
    BGA stiffeners0
    diamond backgrinding wheels0
    dicing wheels0
    etched leadframes0
    interleafs0
    interleaves0
    leadframe boxes0
    mask cases0
    shipping rails0

    www.wadsworth-pacific.com - 2009-02-05

  4. Jewel-designed USB Flash Drives, new idea for gifts and giveaways

    Presenting our new jewel flash drive, a elegant Swarovski crystal butterfly and flower with "System in Package" flash drive module and use "Chip-On-Board" ...
    usb2
    swarovski2
    SiP2
    COB1
    usb flash drives1
    usb drives1
    memory sticks1
    Chip-On-Board1
    System in Package1
    crystal drives0
    i sticks0
    jewel drives0

    www.jewelflashdrives.com - 2009-02-09

  5. Amkor Technology: Amkor Technology: Semiconductor IC Test | Wafer Level Packaging | Wafer Probe | Wafer Bumping | Flip Chip | RF Design | RF Test

    Amkor Technology is the world's leading supplier of outsourced semiconductor interconnect services. With over 35 years of continuous improvement, growth and ...
    PoP4
    flip chip1
    system in package1
    amkor1
    unitive1
    wafer bump1
    amkor packaging0
    amkor technology0
    package on package0
    wafer bumps0
    wafer level pacakaging0

    www.amkor.com - 2009-02-07

  6. KGD Packaging & Test Workshop

    The annual KGD Packaging and Test Workshop in Napa, California focuses on semiconductor die products test, assembly, manufacturing, and business issues at the ...
    conference3
    workshop3
    seminar3
    package3
    tutorial3
    module2
    sip2
    semiconductor2
    reliability2
    wafer1
    dpc1
    stacked1
    burn-in1
    flip chip1
    chip on board1
    kgd1
    multi-chip1
    known good die1
    system in package1
    die products1

    www.napakgd.com - 2009-02-04

  7. Die Products Consortium (DPC)

    The DPC provides information on semiconductor test, assembly, and infrastructure related to known good die (KGD) and implementation of system-in-package (SiP) ...
    board4
    test3
    package3
    tutorial3
    assembly2
    chip2
    bond2
    module2
    pcb2
    sip2
    semiconductor2
    reliability2
    cob1
    wafer1
    stack1
    workmanship1
    mcm1
    dpc1
    flip chip1
    chip on board1
    multichip1
    bare die1
    known good die1
    system in package1
    wirebond1
    die products1
    die products conosortium0

    www.dieproducts.org - 2009-03-04

  8. Pivotal Enterprises

    Marketing and Business Development solutions
    marketing6
    CAD3
    market research2
    business development2
    SIP2
    MCP2
    strategic marketing2
    ams1
    EDA1
    MCM1
    RET1
    TDK1
    DFM1
    mixed signal1
    ben franklin1
    pintail1
    pivotal1
    mixed-signal1
    DFY1
    system in package1
    multi chip module1
    eetimes1
    rencher1
    system-in-package1
    multigig1
    sara myers1
    multi-chip-module1
    mark rencher0
    pintail technologies0
    pivotalenterprises0
    pivotal enterprises0

    www.pivotalenterprises.com - 2009-02-04

  9. Koneltech - revolutionary technologies in PCB design

    Koneltech Oy "Where Quality Joins Efficiency" Service Contacts History FAQs What's new? 28.08.08 - New version 4.2 Build 023 of PCB router TopoR is issued. ...
    design7
    software7
    hardware4
    board4
    integrated2
    module2
    PCB2
    component2
    Embedded2
    sip2
    GUI2
    EMC2
    FPGA2
    Allegro1
    Electra1
    Labview1
    high-speed1
    sib1
    OrCAD1
    DSN1
    actives1
    IMB1
    Specctra1
    P-CAD1
    TopoR1
    Altium Designer1
    system in package1
    Piirilevy1
    Piirilevysuunnittelu1
    Mentor PADS0
    Protel DXP0
    system in board0

    www.koneltech.com - 2009-02-10

asterisk2 sip2 cms4 bga1 voip3 module2 flip chip1 csp1 modules2 pcb2 pbx2 store4

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